🤩Excited to share our latest preprint on Two-Step Glass Wafer Metallization! A simple & efficient solution for improved compatibility between glass & metallic films.
➡️ dx.doi.org/10.2139/ssrn.434336

Our team at Charles University, Centre & have collaborated to bring this innovation to life using laser microstructuring at ambient conditions. The result is a thick layer of the metal film with high adhesion strength & low surface roughness.

This method offers a solution for those working on hardware, as it presents a new alternative to chemical-based copper plating. The procedure is simple and efficient and leads to well-defined grains and grain boundaries in the metal film.

The magnetron-sputtered coating in our preprint did not show delamination from the glass substrate, even at a critical load of 60 N. This demonstrates the strong adhesion of the metal film to the glass substrate, thanks to the unique surface structure created by the laser.

This method of glass metallization will be a game-changer for those in the field of high-frequency electronic devices. The preprint outlines a practical solution for the realization of glass-based circuit materials, offering a more cost-effective alternative to chemical-based copper plating.

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