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As the distance between transistors in chips goes does down towards 0.2nm (2 angstrom) "A2" in 2037 according to roadmap, how will that affect reliability and longevity of the products produced?
As the distance between transistors in chips goes does down towards 0.2nm (2 angstrom) "A2" in 2037 according to roadmap, how will that affect reliability and longevity of the products produced?
Considering 130 nm - 180 nm chips are used for space and 40 nm - 130 nm for automotive, mostly due to radiation affecting reliability.