Broadcom unveils gigantic 3.5D XDSiP platform for AI XPUs — 6000mm² of stacked silicon with 12 HBM modules - Broadcom's 3.5D XDSiP platform for high-performance process... - https://www.tomshardware.com/tech-industry/artificial-intelligence/broadcom-unveils-gigantic-3-5d-xdsip-platform-for-ai-xpus-6000mm2-of-stacked-silicon-with-12-hbm-modules #artificialintelligence #techindustry